Ball mounter_TIREEY_Shanghai Meeyear Intelligent Technology Co., Ltd

product details

Introduce

LK-MT-AP400 PLUS is a BGA fully automatic ball mounter suitable for the BGA ball mounting process of CPU Socket connectors, semiconductor IC chips, and other products. Currently, it has been steadily mass-produced and recognized by high-end customers in the domestic industry.

简介.jpg

Technical parameters

1. Equipment model: LK-MT-AP400 PLUS

2. Appearance specifications: length*width*height=2,400 mm*1,460 mm*1,900 mm

3. Number of operators required: 1

4. Design C/T (one ball mounting cycle): 15S (taking SKV 1700 as an example, 10 pieces can be produced simultaneously)

5. Ball mounting precision: ±0.05 mm; ball mounting yield rate: >99% (excluding reasons caused by the product)

6. Maximum external dimensions (length × width) of applicable product: 300 mm×130 mm

7. Maximum range of ball mounting area (length × width): 280 mm×110 mm (taking SKV 50 mm×45 mm as an example, 10 pieces can be placed)

8. Ball taking capacity: 80,000 pcs

9. Diameter of tin balls: ≥0.15 mm

10. Spacing between tin balls: ≥0.30 mm

11. Product demand: single piece

12. Power voltage: AC 220 V, 50 Hz

13. Gas supply pressure: 0.5 MPa–0.7 MPa

14. Average gas consumption: 80 L/min, rated power: 5 kW

Function introduction

1. Main processes:

Bonding pad coated with flux, with a large amount of solder balls transferred to the pads.

2. Core functions:

① Main process of ball mounter: automatic loading of BOAT material into product → coating of flux → placement and mounting of balls → AOI after ball mounting → automatic discharge of NG products → delivering OK products to reflow oven.

② Incoming products: The products from the upstream assembly line are automatically loaded into BOAT, and then CCD detects the front and back, and mixes materials.

③ BOAT positioning: CCD recognizes the BOAT Mark and guides coating of flux and ball mounting.

④ Solder ball taking: CCD detects if there is any missing balls.

⑤ Solder ball mounting: Laser sensors detect whether balls are stuck on the upper ball plate after ball mounting.

⑥ Finished product after ball mounting: CCD comprehensively detects missing balls, excessive balls, solder ball diameter, and solder ball positional accuracy, etc.

⑦ NG product mapping: Displays the location and type of defects.

Appearance specifications

外型规格.jpg

Mensaje clave:

1. especificaciones de apariencia: largo * ancho * alto = 2400 * 1460 * 1900mm

Process and layout

1. Operation process: automatic loading of BOAT material into product → coating of flux → placement and mounting of balls → AOI after ball mounting → automatic discharge of NG products → delivering OK products to reflow oven.

2. Layout of ball mounter

Principle

Ball mounting principle (transfer printing type ball mounting by gravity)

Key message: 1. The ball mounting TOOLING consists of FLUX dial, upper ball plate for ball taking, and lower ball plate for ball taking.

FLUX transfer printing

FLUX转印EN.jpg

Key message: 1. FLUX coating thickness accuracy: ± 0.01 mm 2. FLUX coating weight accuracy: ± 0.02 mg

Solder ball array

Oscillating ball placement by gravity

锡球阵列.jpg

Key message: 1. The solder balls fall into holes of the lower ball plate under the action of gravity, forming the solder ball array. 2. No solder balls would be damaged, and no excessive or insufficient balls will occur, with a ball placement success rate of 100%.

Vision system

1. Substrate feeding detection

Key message：

The substrate feeding CCD automatically recognizes direction of the substrate and whether ball mounting is carried out, preventing operators from loading the wrong substrate or a substrate that has already been mounted with balls.

2. BOAT visual positioning:

Key message:

The BOAT positioning CCD is equipped with dual high-precision telecentric lenses, which have a large depth of field and small distortion, and eliminate the influence caused by differences in material thickness, achieving a precision of μm level. 2. It is compatible with multiple Mark forms, such as circular, cross, and triangle marks, and the marks whose form in left and right side is inconsistent.

3. Testing of finished products after ball mounting:

Vision system 3.jpg

Key message:

1. After ball mounting, visual inspection is carried out by CCD with high-precision dual telecentric lenses, which have a large depth of field, small distortion, and a system precision of ±0.015 mm.

2. It can detect information such as the number, diameter, and position coordinates of solder balls, and generate a solder ball location map.

3. It can detect the relative position between the solder balls and the Mark points, and position of solder balls.

Standard equipment

Auxiliary equipment

Precision mold

Consumables

Standard equipment

Stamping

Injection molding

Stamping

Injection molding

Standard parts

Auxiliary equipment

Standard equipment

Standard parts

Auxiliary equipment

Consumables

Tireey Connector

Ball mounter

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